Jasper analyzed good read..

[coolguy]

there is a write up over at AnandTech about the new jasper console.
they tell us what to look for and what codes to look for

http://anandtech.com/gadgets/showdoc.aspx?i=3472

[Insanehead]

I love to see them doing some stress test to see the reliability of the updated chips.

[F34R]

That was a pretty nice article. +rep

[radgamer420]

An interesting article. As it has already been stated in this thread I'd like to see a stress test as well. Anyway +rep for the article.

[coolguy]

on the third page of the story they have a stress test

[FinalReaper]

Hmmm wierd I have the code 14,2A but, the power connector is the same as the jaspers...Weird.

Anyways good read and all that.

[Thegamingdwarf]

^^ To the post above, since you are not generating so much heat, the components are far less likely to separate.

As for the article, it was a nice read, I think the re-design will eradicate the RROD problem (admittedly 3 years late, but still better late than never) because not only is it more efficient, but also the circuitry is more effectively constructed and laid out. The earlier dissections of 360's showed a complete mess of electronics, where as this is nice and neat, as it should be .

[Glass-X]

After another careful read, one of the theories is that the problem was within the GPU and that power-cycles, not heat was causing the problem. Assumption in this case is that with GPU now being made on 65nm architecture, that there must have been some re-work done on the GPU itself, and that might have solved the RROD problem.

[Glass-X]

Doesn't the article suggest that the problem lies within the GPU itself and not with how the GPU connects to the motherboard? Or am I reading it wrong. According to the conclusion, it appears that you can buy a Jasper and over time the materials within the GPU will still separate - only advantage being that now you're saving power and generating less heat.

[Popcorn]

Doesn't the article suggest that the problem lies within the GPU itself and not with how the GPU connects to the motherboard? Or am I reading it wrong. According to the conclusion, it appears that you can buy a Jasper and over time the materials within the GPU will still separate - only advantage being that now you're saving power and generating less heat.

What I understood is that the new motherboard uses less power therefore less heat and stress in the GPU/CPU connections and the guy did speculated that the solution to the solder problem for the 360 could be switching to a different high-lead bumps from (90% lead,10% tin) to eutectic bumps (37% lead,63% tin) like ATI did to avoid the same problems NVIDIA had with their GPUs.