Quote Originally Posted by Fijiandoce View Post
no?
but its as itachi said. price. of all the things you put in your console (to bring to market), the heat dispersion method only needs to pass a sufficient level of cooling, does it not?
why increase cost here when you can use that somewhere else? more-so, when a slimmer, cooler, more efficient model is part of the products plan?

out of genuine curiosity, how would you cool a launch PS3? you cannot decrease price or change the shape...only your method of cooling
I would put in better quality heatsinks /thermal compound, possibly redesign the fan setup and likely not use lead free solder.

And are you really advocating selling people faulty products because it doesn't make sense to invest in a good cooling system because it won't be necessary in later revisions?