PS5 tear down Video.

[arfi-gorgona-O]

This is the tear down video of PS5,its fresh,posted without even watch it yet.
PS: watched it and I have to say that the unit screams quality.So much attention to detail by Sony...It even has 2 dust catchers,making easier collecting the dust from the inside of PS5,and able to be vacuumed by the end user damn....

 

[Two4DaMoney]

Nice breakdown. That is some heavy duty cooling they have going on.

 

[arfi-gorgona-O]

Nice breakdown. That is some heavy duty cooling they have going on.

Indded,and that attention to detail for everything....This is why the 1st generation systems are usually the best Quality ones...

 

[Fijiandoce]

Can say unequivocally that the PS5 is a cooler running machine than the 'X', don't even need metrics to confirm. Liquid metal is an instant 10-20C drop in temps (relative to traditional paste on the same die), and that copper heatblock is thick! Same for the fan! That's one big boi lol.

That stand was neat as well, over engineered, but neat i guess.

Looking at the way they've set up the storage was interesting tho. Any additional NVME will just function as a plug and play since what comes in the box is physically soldered to the mobo. Wonder how they'll handle someone chucking in a pcie gen3 NVME?

 

[Aquanox]

First thing that strikes is the the gigantic size of the console. (And the heat sink)

Also... I wonder how are the expansion NVMEs going to cooled down. 🤔 I guess there's some airflow somewhere.

The positive thing is the liquid metal. I think a silent PS5 can be a reality now. It took an insane amount of space but if that's what took Sony to reduce the noise and heat, then so be it.

Edit: BTW Kudos to Sony for finally unveiling the console's hardware.

 

[Fijiandoce]

I wonder if they've changed the LM tim any?
These things dry out and lose a bunch of their performance. So much so they end up being a little worse than traditional paste. I change mine every year just to be safe. Not too sure what the actual legs on them are truth be told.

Probably not too hard to engineer a longer lasting, less conductive LM for their use case. At 350W max they have a positively chunky mass for a heat sink, and an absolute unit of a fan (for reals, that thing is huge!) to push air through. You probably don't need a LM that's would shift 20c (for example). A 5-10C (over traditional paste) that last 5+ years would probably be plenty.

EDIT: NVM, just looked back at it and it looks like they are trying to insulate the LM. Air getting to LM dries it out, so probs just trying to avoid that.

 

[arfi-gorgona-O]

The system is bigger then what we used too,but it seems a lot worse near this guy.He is a tad tiny for a guy lol

 

[Aquanox]

BTW... don't know if anyone saw that Russian PS5 leak. Well, this one proves it was legit.

They've also shown the cold boot of the PS5 if anyone's interested. (And a "curious" looking black controller)

Another piece of information taken from the video, they directly address the fact that they couldn't use a vapor chamber for it (which is 20-30% more effective for heat cooling) given the design Sony went for. Probably the reason behind using liquid metal to compensate.

 

[NoUseMercenary]

Nice to see that the PS5 is easy to disassemble. Can clean the fans if need be and the extra storage slot seems easy to get to. And that heat sink is massive!

 

[Fijiandoce]

Another piece of information taken from the video, they directly address the fact that they couldn't use a vapor chamber for it (which is 20-30% more effective for heat cooling) given the design Sony went for. Probably the reason behind using liquid metal to compensate.

That's a bit of a gross generalization tho. There's more to heat sinks than just the point which makes contact. Thermal mass, and volume of air moving through said mass also have a significant effect in how effective the cooling solution is. Heat pipes are useful in moving heat away from a point, this is why they are favoured in PC's, and also GPU's.

GPU's kinda prove this point. Look and any AIB and they all use heatpipes. The reference designs use vapor chambers, and perform worse (some times significantly so if your name is AMD). This is because AIB's can use heat pipes to move the heat from the die, to massive heat sinks above them. There they then stick massive fans on said heat sinks.

 

[Libra-75]

That was interesting to watch. Overall it seems like good solutions and cool design details. The only thing that worries me a little bit is the soldered on SSD. But hopefully it's made to last.

I wonder if we're going to see 3rd party side panels and/or if Sony is going to offer different designs? Or do you guys think we will only see different editions of the PS5?

 

[Fijiandoce]

I wonder if we're going to see 3rd party side panels and/or if Sony is going to offer different designs? Or do you guys think we will only see different editions of the PS5?

Can probably bet money there will be a fortnite one ready to go for launch. urgh!

 

[Two4DaMoney]

I love the design of this Spider-Man PS5. The back faceplate wouldn't work if you have to lay your ps5 on its side but that could easily be fixed by the designer.

 

[Aquanox]

That's a bit of a gross generalization tho. There's more to heat sinks than just the point which makes contact. Thermal mass, and volume of air moving through said mass also have a significant effect in how effective the cooling solution is. Heat pipes are useful in moving heat away from a point, this is why they are favoured in PC's, and also GPU's.

The general use of heat pipes in GPUs is because they're basically tied to the ATX Form Factor, hence, they need to move heat instead of spreading it (long boards that can't have too much height)

But anyway... it's not necessary to get too deep into it, the Sony guy himself implies that Vapor Chambers are more efficient: "Like PS4 and PS4 it uses a heat pipe. However .......... we made it possible to achieve the same performance as a Vapor Chamber".

 

[Fijiandoce]

The general use of heat pipes in GPUs is because they're basically tied to the ATX Form Factor, hence, they need to move heat instead of spreading it (long boards that can't have too much height)

Can't say i've heard this as an issue. Vapor chambers are traditionally constrained by their size. On GPU's they can clear the mosfets, and chokes fine but then can't go any further than the motherboard behind it (or realistically the end of the card). This is the same reason why they aren't used on CPU's since there is no set standard save for the mounting points.

But anyway... it's not necessary to get too deep into it, the Sony guy himself implies that Vapor Chambers are more efficient: "Like PS4 and PS4 it uses a heat pipe. However .......... we made it possible to achieve the same performance as a Vapor Chamber".

That's a good thing, no? It means that by using heat pipes, they've designed it such that they have enough heat transfer between the heat pipes, and their fin array. The 3080 is a 300W+ TDP card and it makes do with a heat sink comparatively smaller.

So the LM is more akin to overkill, then compensation. If i had to hazard a guess, i'd say it is more to keep the fan speed as low as possible. That fan type can move a bunch of air, but will get perceptibly loud (no idea how noticeably tho) as it spins up.

 

[Aquanox]

Can't say i've heard this as an issue. Vapor chambers are traditionally constrained by their size. On GPU's they can clear the mosfets, and chokes fine but then can't go any further than the motherboard behind it (or realistically the end of the card). This is the same reason why they aren't used on CPU's since there is no set standard save for the mounting points.

And this is the reason why you might want to go for a Vapor Chamber wherever you're not constrained by form factor standards.

That's a good thing, no? It means that by using heat pipes, they've designed it such that they have enough heat transfer between the heat pipes, and their fin array. The 3080 is a 300W+ TDP card and it makes do with a heat sink comparatively smaller.

So the LM is more akin to overkill, then compensation. If i had to hazard a guess, i'd say it is more to keep the fan speed as low as possible. That fan type can move a bunch of air, but will get perceptibly loud (no idea how noticeably tho) as it spins up.

Not saying it isn't good. Just pointing out that in order to achieve their cooling goals with heat pipes they had to go for a huge heat sink + liquid metal. Also, the fact that the silicon is so heavily overclocked was a deciding factor. This part is also implied in the video.

 

[arfi-gorgona-O]

I love the design of this Spider-Man PS5. The back faceplate wouldn't work if you have to lay your ps5 on its side but that could easily be fixed by the designer.

Only if this light in there was an RGB....you could customise it with every new facePlate and color...

 

[arfi-gorgona-O]

And this is the reason why you might want to go for a Vapor Chamber wherever you're not constrained by form factor standards.



Not saying it isn't good. Just pointing out that in order to achieve their cooling goals with heat pipes they had to go for a huge heat sink + liquid metal. Also, the fact that the silicon is so heavily overclocked was a deciding factor. This part is also implied in the video.

Oc is when you are trying to go above the GPU specs.But we already know that RDNA2 Cards with even more CUs are around the same clock as a PS5.So it higher clocked not Oced.

 

[Fijiandoce]

And this is the reason why you might want to go for a Vapor Chamber wherever you're not constrained by form factor standards.

Not entirely sure what you're referencing here since the only reference i have to ATX is motherboard standards... and a typical gpu slots into ITX all the same, even the AIB variants. That being said, if you are constrained to a standard, you would want to use a vapor chamber, so long as you had clearance from the board the dies sits on (no chokes, mosfets, caps etc. blocking). You clear more heat for a given area than you would with pipes.

Not saying it isn't good. Just pointing out that in order to achieve their cooling goals with heat pipes they had to go for a huge heat sink + liquid metal. Also, the fact that the silicon is so heavily overclocked was a deciding factor. This part is also implied in the video.

The amount of heat is a function of the amount of energy passing through the chip. At most, the unit pulls 350W (since we know that now), and not all that passes through the chip (see note on 3080 above). An overclock is only relevant to two chips that are the same. The closest point of comparison here is the 'X', and even that isn't the same since the GPU is inherently bigger by design - Vega 56 uses ~200W, whereas Vega 64 uses ~300W. Overclocking the 56 could bring it up to ~300W, but its still only 300W. It doesn't somehow consume more by virtue of having higher clocks.

 

[Aquanox]

But we already know that RDNA2 Cards with even more CUs are around the same clock as a PS5

Which RDNA 2 Cards? I might've missed something.

 

[Aquanox]

, if you are constrained to a standard, you would want to use a vapor chamber,

You mean, if you're not constrained?... Which would be the case of the XSX.

 

[Fijiandoce]

You mean, if you're not constrained?... Which would be the case of the XSX.

Nope. If you are constrained, as would be the case with the 'X'. The shape of the 'X' is heavily influenced by the 140mm fan they have at the top.

 

[arfi-gorgona-O]

Which RDNA 2 Cards? I might've missed something.

By the recent leaks Navi 2 is able to go as high as 2.5ghz.

https://videocardz.com/newz/amd-navi-21-to-feature-80-cus-navi-22-40-cus-and-navi-23-32-cus

 

[Aquanox]

Nope. If you are constrained, as would be the case with the 'X'. The shape of the 'X' is heavily influenced by the 140mm fan they have at the top.

Oh, I see it the other way around. They could've chosen any kind of fan. They decided to go for a 140mm and build the console around it. Never been done before in the console world. You might even consider its form factor as controversial. In order to use a Vapor chamber more efficiently, they split the Mobo in two. As a result, they ended up with a smaller, better distributed console and well cooled with presumably more better and bigger airflow as well.

 

[Fijiandoce]

Oh, I see it the other way around. They could've chosen any kind of fan. They decided to go for a 140mm and build the console around it. Never been done before in the console world. You might even consider its form factor as controversial. In order to use a Vapor chamber more efficiently, they split the Mobo in two. As a result, they ended up with a smaller, better distributed console and well cooled

The theory is sound at least. They've gone for a chimney design since heat naturally rises. Keeping it squared off to the edges tho was a good decision because Apple rounded off their design and ended up being ridiculed for it mercilessly.

EDIT: Just wanted to note that on fan size there's only really 120mm/140mm, or ludicrously oversized as far as "standard" fan sizes go. The 240mm [the ludicrously oversized] ones don't even have standardized mounting points yet. The 120mm ones are too small, and the 'X' would have been absolutely massive if they used the same concept with a 240mm.

with presumably more better and bigger airflow as well.

The fan design in the PS5 pushes a greater volume. Volume is heavily influenced by speed however, but i imagine both will run low rpm anyways. As i said at the top, between the two, Sony definitely have the better cooling solution, but that's not to say the other is 'bad'. It might be a little warmer but no ones really going to notice once they start playing games. Both will probably stay quiet enough which i think was the goal for both.

 

[Aquanox]

By the recent leaks Navi 2 is able to go as high as 2.5ghz.

https://videocardz.com/newz/amd-navi-21-to-feature-80-cus-navi-22-40-cus-and-navi-23-32-cus

Uhmm that leak. That'd be for RDNA 2 GPUs... I prefer not to go into that debate again.

 

[arfi-gorgona-O]

Uhmm that leak. That'd be for RDNA 2 GPUs... I prefer not to go into that debate again.

What do you mean by that....arent both consoles using an RDNA2 GPU variant from amd?Please tell me that you dont beliave that crap that PS5 is using RDNA 1.5. lol

 

[Aquanox]

As i said at the top, between the two, Sony definitely have the better cooling solution, but that's not to say the other is 'bad'

It depends on what you consider "better". I do believe PS5's cooling solution will be massively better and more silent than that on the PS4. It just took them a lot more space + liquid metal (allow me to be cautious with this one). I think they're also dealing with a much hotter silicon (smaller die with higher clocks) than the XSX but that's a different story. Doing an analogy, I'd say they went for brute force whereas XSX went for efficiency. As long as they keep their units on safe limits and under acceptable noise, it's all good.

 

[arfi-gorgona-O]

It depends on what you consider "better". I do believe PS5's cooling solution will be massively better and more silent than that on the PS4. It just took them a lot more space + liquid metal (allow me to be cautious with this one). I think they're also dealing with a much hotter silicon (smaller die with higher clocks) than the XSX but that's a different story. Doing an analogy, I'd say they went for brute force whereas XSX went for efficiency. As long as they keep their units on safe limits and under acceptable noise, it's all good.

I know what i consider better.The cooler and silent solution,is the best one.Either way,i dont think any of them,will have problems,cooling the system efficiently.Both are too beefy.

 

[Fijiandoce]

It depends on what you consider "better".

As someone with no stake in either outcome of two pieces of plastic it's as it says on the tin; Neither is bad, one is better.

liquid metal (allow me to be cautious with this one).

As I said above, LM is an automatic 10-20C off temps.

I think they're also dealing with a much hotter silicon (smaller die with higher clocks) than the XSX but that's a different story.

I clarified this one above, but by all means, you're free to ignore and believe what you want.

Doing an analogy, I'd say they went for brute force whereas XSX went for efficiency.

Bad analogy. AMD's design. Efficiencies are what AMD designed them to be. A bigger die inherently consumes more power, and therefore creates more heat. Again, i clarified this as well.