A new rumour doing the rounds has revealed that the PS6 is set to utilise AMD’s 3D stacked chips, following news that Sony Interactive Entertainment has partnered with the chip manufacturer for Project Amethyst.
A report by a Chinese leaker has now claimed that AMD is working on X3D chips, believed to be the next-generation Halo, and that it is looking at the possibility of stacking 3D V-Cache on both the CPU and GPU. It’s also mentioned that the PS6 APU will include 3D V-Cache to improve gaming performance.
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AMD is also expected to launch its next-generation UDNA lineup, replacing the current RDNA and CDNA families. Mass production is expected to kick off in Q2 2026, and will also be integrated into next-generation consoles including PS6. Furthermore, the UDNA is anticipated to expand on the AI Machine learning tech that powers PlayStation Spectral Super Resolution (PSSR), so therefore we can expect the PS6 to see step change in PSSR versions, potentially from 1.0 — 2.0.
Regarding the PS6, Circana’s Mat Piscatella has previously stated that he believes the PS6 and new Xbox console will retail for at least $600, which would make sense given its high-end architecture.
[Source – WCCFTech]