The PS5’s heatsink has been showcased in the PS5 Teardown from Sony and the first images for it show that it is absolutely massive.
Aside from the PS5’s heatsink being big, Sony revealed that there is a very high thermal density in the silicon die, which required them to significantly increase the performance of the thermal conductor that sits between the SoC and the heat sink. Much like the PS4 and PS5, the console uses a heat pipe, but the shape and airflow have been altered to achieve the same performance as a vapor chamber. You can watch the PS5 teardown video below:
All this PS5 news comes just a month before the console is set to release in November worldwide. Currently, Sony is in contention for the PS5 trademark in India, as they were beaten to it by 3 months. We also took a look at how Sony will compete with all the cloud gaming and subscription services in the new console generation.
The PS5 releases on November 12, 2020, in the US and November 19, 2020, in the UK and EU.